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MCP46XX PICTAIL? PLUS
DAUGHTER BOARD USER ’S GUIDE
Appendix B. Bill Of Materials (BOM)
B.1
BILL OF MATERIALS (BOM)
This appendix contains the Bill Of Materials for the MCP46XX PICtail? Plus Daughter
Board.
TABLE B-1:
BILL OF MATERIALS (BOM)
1
1
1
Qty
Reference
C1
C2
J2
Description
CAP .1UF 25V CERAMIC X7R 0805
CAP 1.0UF 16V CERAMIC X7R 0805
CONN HEADER 6POS .100 VERT TIN
Manufacturer
Panasonic ? - ECG
Kemet ? Electronics
Molex/Waldom ?
Part Number
ECJ-2VB1E104K
C0805C105K4RACTU
22-28-4060
Electronics Corp
3
JP1, JP2, JP3
CONN HEADER 2POS .100 VERT TIN
Molex/Waldom
22-03-2021
Electronics
4
JMP1, JMP2,
CONN HEADER 3POS .100" STR TIN
Molex/Waldom
90120-0123
JMP3, JMP4
Electronics Corp
1
PCB
RoHS Compliant Bare PCB,
MCP4XXX PICTail Plus Daughter Board
Microchip Technology 104-00182
Inc.
1
R1
RES 100 OHM 1/8W 1% 0805 SMD
Panasonic - ECG
ERJ-6ENF1000V
8
R2, R5, R6, R7, RES 10.0K OHM 1/8W 1% 0805 SMD
Panasonic - ECG
ERJ-6ENF1002V
R8, R9, R11,
R16
2
3
1
R3, R4
R12, R13, R17
U1
RES 500 OHM 1/8W 1% 0805 SMD
RES 0.0 OHM 1/8W 5% 0805 SMD
ANALOG MUX, DUAL, 4-CHANNEL,
Panasonic - ECG
Rohm
Maxim
ERJ-6ENF5000V
MCR10EZPJ000
MAX4582LEEE
CMOS, SSOP, 16PIN, PLASTIC
16-QSOP
1
U2
MCP454X/456X/464X/466X, 7/8-Bit
Single/Dual I 2 C Digital POT with
Microchip Technology MCP4661T-103E/ST
Inc.
Non-Volatile Memory
12
VA0, VW0, VB0, PC TEST POINT COMPACT SMT
VA1, VW1, VB1,
Keystone
Electronics ?
5016
VSS, AVDD
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
TABLE B-2:
BILL OF MATERIALS — COMPONENTS NOT INSTALLED
Qty
0
J1
Reference
Description
DO NOT POPULATE
Manufacturer
—
Part Number
—
CONN HEADER 6POS .100 VERT TIN
0
R10, R14, R15,
DO NOT POPULATE
—
—
R18
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
? 2009 Microchip Technology Inc.
DS51804A-page 35
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